PECVD (Plasma Enhanced Chemical Vapor Deposition):

PECVD, short for Plasma Enhanced Chemical Vapor Deposition, is a deposition technique used to create thin films on substrates. It involves the use of a plasma, which is a highly energetic and ionized gas, to assist in the chemical reactions that form the desired film.

In the PECVD process, a precursor gas or a mixture of gasses is introduced into a vacuum chamber containing the substrate. The chamber is then filled with a low-pressure plasma, typically generated by applying radio frequency (RF) or microwave energy to the gas.

The plasma contains various ions, electrons, and reactive species that can chemically react with the precursor gasses. These reactions lead to the deposition of a thin film on the substrate surface. The plasma also provides additional energy to the process, aiding in the breakdown of complex molecules and enhancing film properties.

PECVD is widely used in the semiconductor industry for depositing thin films of materials such as silicon dioxide (SiO2) and silicon nitride (Si3N4) for insulation and passivation layers. It offers advantages such as low deposition temperatures, conformal coating capability, and the ability to deposit films with controlled properties. PECVD is essential for the fabrication of integrated circuits and thin film-based devices.